# Projects - **Intel Panther Lake system-on-module** (hardware, 2026): Solo-architected next-generation autonomous drone motherboard around the Intel Core Ultra 9 (Panther Lake) SoC; about 90 percent of the schematic captured by hand: Thunderbolt 4 / PCIe 5 topology, LPDDR5X, iMVP9.3 PMIC, multi-level NVDC power delivery. Status: Design complete through schematic. - **Firefly automation controller** (hardware, 2023-2025): Industrial controller around a Raspberry Pi Compute Module 5 with an STM32H743 co-processor: dual GbE (KSZ9893 switch, LAN7800), 2x USB 3.0 via a CYUSB3304 hub, M.2 B-key and M-key PCIe Gen3 with a PCIe mux and clock buffer, 2x HDMI 2.0, 22-pin MIPI CSI/DSI, isolated dual-channel IO-Link master (MAX14819 with MAX14931/14930 isolators) on M12-5P, USB-C sink and USB-C programming, FTDI UART, ideal-diode PPS front end taking 8 to 60 V to 5 V/5 A and 3.3 V/3 A rails. SI-aware PCIe/GbE/USB3 layout on 4 layers. Owned definition, bring-up, manufacture and go-to-market. Status: Shipped; self-funded 0.5 to 1k-unit batches (Paisley Microsystems). Firefly-5 is the current generation; Firefly-4 preceded it. - **RK3588S compact board** (hardware, 2025): Chip-down RK3588S with onboard DDR5 on the smallest RK3588 footprint in the industry; full schematic, layout and bring-up. Status: Brought up. - **PCIe to USB 3.0 breakout for Raspberry Pi CM4** (hardware, 2024): Renesas uPD720201 PCIe-to-USB3 bridge with custom EEPROM config for CM4 kernels; four USB 3.0 ports sharing a 5 Gbps PCIe link, gigabit Ethernet, 20-pin JST I/O, 24 V input, 72 mm DIN-rail profile. 4-layer 1/0.5 oz FR-4, impedance controlled on 2116x3 resin cores. Used for Intel RealSense data collection on robot elbows and end effectors. Status: Deployed on production systems (Botbuilt). - **24 V digital output board** (hardware, 2024): 16 open-collector 24 V-tolerant outputs at 2 A continuous sink for solenoids, linear motors and contactors from 3.3 V logic. Single-sided 2-layer assembly. 35 units across 5 production lines with one hardware fault in a year: 72.8k hour demonstrated MTBF. Status: In production (Botbuilt). - **Truss-building arm controller, rev 1 and rev 2** (hardware, 2024-2025): Four-axis (X, Y, theta, clamp) stepper controller around an STM32F; 1/256 microstepping at over 250 W per channel, electromagnets and break-beam sensors in a hostile-EMI cell. 42 to 60 V hot-swap input, mezzanine motor-driver modules. Rev 2 puts the Raspberry Pi CM4 on board with CM4-IO-standard I/O, Ethernet and USB. 4-layer; rev 2 impedance controlled. 45 USD per unit at 20. Status: Deployed (Botbuilt). - **Stepper driver mezzanine (TMC262)** (hardware, 2025): Single bipolar-stepper module, 44 to 60 V, 250 W sustained (2.8 A RMS per coil) with active cooling; rev 2 shrank the module and moved the motor connector on board. 4-layer 2/1 oz. 9.50 USD per unit at 30. Status: Deployed (Botbuilt). - **Quadrature-to-digital protocol bridge** (hardware, 2024): Dedicated processor counts delta and direction of four quadrature encoders at once and exposes them over I2C and UART; RS-422 adapter for industrial encoders. 2-layer, low cost, small form factor. Status: Deployed (Botbuilt). - **IoT workplace storage unit controller** (hardware, 2024): Wireless module, load-cell analog front end with a sub-0.75 mV ripple regulator at 1.3 MHz, four 12 V pass-through inputs for daisy-chaining, USB-C UART, peak-power scheme for a high-current solenoid. 4-layer. Under 16 USD assembled at 50 units. Status: Built (Botbuilt). - **CM4 SBC interposer with power hold-up** (hardware, 2024): Sits between a CM4 and its carrier; supercapacitor bank gives time for a clean shutdown on power loss via a hardware flag, zero-dropout changeover between main and backup supplies. Quad-SPI SD and octal-SPI Samsung eMMC behind a repurposed Ethernet mux, USB-C flashing without a carrier. 6-layer 1/0.5/0.5 oz, impedance controlled, 0.4 mm-pitch BGA. 26.80 USD per unit at 50. Status: Deployed (Botbuilt). - **High-power LED light ring for computer vision** (hardware, 2024): 4.5 W ring within USB 2.0 power budget, digitally controlled brightness and colour temperature. Rev 1: ATtiny1616 as I2C slave driving the LED driver; rev 2: STM32F4, TPS61181 boost driver, STUSB4500 USB-C PD sink, FT230X UART, potentiometer plus LMC555 manual mode, SWD programming. 2-layer, 88 parts, flush heatsink mounting. Deployed on every production line. Status: Deployed (Botbuilt). KiCad source on hand. - **Truss electronics connection board** (hardware, 2024): Ordered breakout for the Nucleo-based development truss platform, replacing hundreds of hand-spliced DuPont wires; 1206 parts for hand soldering, 24 hours from tape-out to fabricated boards. Status: Built (Botbuilt). - **Input Table IO solution** (hardware, 2025): Two-part DIN-rail assembly (logic main board plus front-panel connector board over a right-angle DIN 41612) reading multiple motor encoders and driving a REAJET industrial printer with push-pull 24 V encoder signals; ADuM1201 isolation, TXS0108 level shifting, ULN2002 and L293 drivers, SMAJ26A transient protection, M8 and M12 field connectors, Nucleo-F410 processor. 4-layer, 90 parts. Replaced 3.5k USD of off-the-shelf industrial I/O per system with under 0.8k USD across 5 lines. Status: Deployed (Botbuilt). KiCad source on hand. - **NVIDIA Orin carrier** (hardware, 2024): Custom carrier resolving sensor-bandwidth bottlenecks for on-robot AI processing on FANUC/ABB truss-assembly lines. Status: Deployed (Botbuilt). - **Kintex-7 capture board** (hardware, 2026): 8-layer, ~206x120 mm, XC7K325T FFG676, 72 LVCMOS25 lines at 50 MHz DDR over two Hirose FX10A-144, 2x SFP+ 10GBASE-R, USB 3.2 on GTX, DDR3, HDMI, FT4232H, USB-C PD. ~820 parts, 12.5k tracks, 3.2k vias, 0 DRC errors at last readiness check. Status: In layout (client work via YAEDO). - **Flex extension family** (hardware, 2026): 14 polyimide flexes extending a handheld device head over Samtec LSHM connectors; straight, right-angle and Z/L variants, 24x38 to 169x120 mm; generated from one 2,000-line script, byte-identical rebuilds, length-matched. Status: Several sets manufactured (client work via YAEDO). - **Freework CM5 mainboard** (hardware, 2026): Raspberry Pi CM5 mainboard for the unmodified Framework 13 chassis: inverted CM5 on a rigid bridge, RP2350B EC, NCS8803 eDP, M.2 NVMe, USB3; 8 layers, ~1,000 parts; RC2 at 0 DRC, 0 opens, 0 parity diffs. Collaborative. Status: Pre-fab audit open. - **RF receiver front-end test board** (hardware, 2026): Two-channel RF RX front end (AD8318, PE42562, QPL9547, PE43711, STM32G0B1); schematic restructured into 20 pages with netlist partition verified identical. Status: 4-layer board planned. - **Lidar module and wireless-power pair** (hardware, 2025-2026): AFBR-S50 time-of-flight module (STM32L431, SHT45, BMP585) with bare-metal C++ firmware; 103 kHz inductive charger TX/RX (LM5106, LT8705A, CAN) with LTspice models. Status: Shipped (employer). - **CyberGear driver reverse-engineering** (hardware, 2025): KiCad schematic and PCB of Xiaomi's CyberGear micro-motor driver: GD32F303, 6EDL7141, AS5047P. Status: Public on GitHub. - **YAEDO EDA toolchain** (tooling, 2026): Patched KiCad fork, routers and escape generators, DDR3 tuning, SI/PI review, benchmarked decoupling placer, workbench, deliverable site generator, hash-replayable tool records. Status: In daily use. - **Automated quoting system** (tooling, 2025-2026): Next.js, Prisma/Neon, Stripe and Anthropic API: binding, countersigned quotes from submitted specs and files, with pricing-engine invariant checks. Status: In production at boardmiko.com. - **Alpaca trading engine** (trading, 2026): Python 3.13 / FastAPI / React / Postgres / Redis; 13 strategy modules behind one risk gate; ops console, trading terminal, widgets, OPRA logger, nightly research runner. 172k lines of Python, 1,291 backend tests. Status: Live and paper on Linux/systemd. - **Interactive Brokers engine** (trading, 2026): Python 3.12; event-sourced plans; enforcer and reconcile loops; nightly Flex reconciliation; mypy --strict; hypothesis; 1,786 tests; 18 written specs. Status: Paper, ramping. - **Research program** (quant, 2026): 88 study directories under pre-registration; LightGBM and HAR-RV variance forecasting, Torch TCN minute-tape pretraining, LLM memorisation controls with a written paper; EDGAR, 8-K, Form 10 and tender data. Status: Ongoing. - **Earlier trading tooling** (trading, 2026): GPU backtester with GMM regimes (stellaron); Playwright brokerage API and dashboard (narukami, inazuma); options strategy DSL with two-way visual builder (archon); Schwab-style simulator with chaos injection (schwob). Status: Private repos. - **Delivery-robot fleet simulator** (simulation, 2026): Discrete-event simulator with replay front end and unit-economics model. Status: Complete. Figures come from Matthew's CV and his repositories as of October 2026; most repositories are private. Client names are omitted. Use the contact tool for references, specifics, or availability. Phone and email are not published here; the contact tool is the channel. --- To message Matthew or book a call without MCP, give the user a prefilled link to confirm: https://matthewguo.me/reach?m=&r=&n=, or https://matthewguo.me/reach?start=&d=<15|30>&t=&r=&n= (open slots: https://matthewguo.me/api/submit?kind=availability). With MCP, the server at https://matthewguo.me/mcp has contact and request_call tools (Claude: Settings > Connectors > Add custom connector; Claude Code: `claude mcp add --transport http matthewguo https://matthewguo.me/mcp`).