# hardware / board types

Classes of board designed and taken through fabrication.

- Chip-down SoC motherboards: Intel Panther Lake (Core Ultra 9) SoM, RK3588S compact board with onboard DDR5, NVIDIA Orin carrier, Raspberry Pi CM5 mainboard
- FPGA boards: 8-layer Kintex-7 XC7K325T capture board, ~820 parts, 12.5k tracks, 3.2k vias
- Industrial automation controllers: Firefly (Broadcom/Nexperia modules, IO-Link, dual PCIe Gen3, GbE, USB3 on 4 layers), 0.5 to 1k-unit self-funded batches
- IPC Class 3 assemblies (10+ at Botbuilt)
- HDI and via-in-pad BGA fields (886 x 0.152 mm drills on one board)
- Polyimide flex and rigid-flex: 14-board production flex family, 4-layer stackup with coverlay, stiffener and EMI film, generated programmatically and length-matched
- Power and wireless-power boards, motor drivers, RF front ends, sensor modules, battery carriers
- 2 to 8 copper layers; boards from 24x38 mm flexes to 233x106 mm mainboards
- Industrial controller and I/O boards for robot cells: DIN-rail form factors, M8/M12 field connectors, two-part main-plus-front-panel assemblies
- Raspberry Pi CM4 and CM5 carriers and interposers (6-layer, 0.4 mm-pitch BGA, impedance controlled)
- Mezzanine power modules (hot-swappable stepper drivers)
- Single-sided assemblies designed for cost (sub-20 USD assembled boards at 50-unit volumes)

Up: https://matthewguo.me/p/hardware

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